电子科技大学：《集成电路可测性设计 VLSIDesign》课程教学资源（课件讲稿）第1章 概述——测试的基本知识

二、测试的基本知识

二、测试的基本知识

讨论几个概念 IC验证(IC Verification) IC测试(IC Testing) 2020/9/4 集成电路可测性设计 3

2020/9/4 集成电路可测性设计 3 讨论几个概念 IC验证（IC Verification） IC测试（IC Testing）

讨论几个概念 Verification: Testing 1. Goal-Functional Correctness before (Manufacturing/Production Test) tapeout 2. Methodologies-Simulation along with 1.Wafer Sort Testing Formal,Power aware,Emulation and 2. Burn-In Stress Testing prototyping 3. Fault/Defects Testing 3. Increasing scope -Performance,Power, 4. Characterization Safety.Security 4. Critical as any bug escaped is costly 5. Functional Testing for production Testing (Manufacturing/Production Test) Verification Validation Volume Chip Design and Development-Life cycle Shipment Specifications Architecture RTL Design Physical Chip In House Design Tapeout Microarchitecture back from fab】

2020/9/4 集成电路可测性设计 4 讨论几个概念

讨论几个概念 design manufacture Specifications Silicon description in Design Code/Netlist/ IC chips sentences or codes layout Physical devices =? Verification Testing (for bugs) (for defects) Source from i NTU 2020/9/4 集成电路可测性设计 5

讨论几个概念 2020/9/4 集成电路可测性设计 5 Source from NTU

测试(Testing) A manufacturing step that e ensures that the physical device, manufactured from the synthesized design,has no manufacturing defect PASS FAIL ATPG ATE 测 ATE 合格/ 建模 测试图形 测试施加 被测电路 试 比较 不合格 生成 响 →BIST← 理想结果 Testing is a Decision！!！ 2020/9/4 集成电路可测性设计 6

2020/9/4 集成电路可测性设计 6 测试（Testing） A manufacturing step that ensures that the physical device, manufactured from the synthesized design, has no manufacturing defect PASS FAIL Testing is a Decision!!!