Evaporation and sputter deposition [15] 1. a)In the plasma of a sputter deposition system, consider an argon atom that is ionized during a collision in the plasma. i) Express the ratio of the acceleration of the liberated electron to that of the argon ion in terms of M and m, the mass of the ion and electron; give the numerical value of this ratio, and say in which

This is an open book, take-home quiz. You are not to consult with other class members or anyone else. You may discuss the solution to this exam only with the course staff

Some useful equations for Quiz# 2 Constants:kB=1.38×1023J/K=862×105eV/K,e=16×101Coul I atm=760 Torr=10 Pa Ideal gas: Pv=NkBT N/=n=C(concentration), J

Write a compact sentence that describes the molecular origin of gas pressure, including its temperature and mass dependence. [51 A: P is due to change in momentum Ap = m Av of molecules striking a surface velocity Increases as VTm

Microelectronics Processing Technology Spring Term, 200. Quiz 1 90 min/90 points total March 19 2003 Note: Be brief and relevant in your answers, and use sketches. Show your work. k=1.3810-23J/K=8.6210-eV/K 40 1. Film deposition, CVD )Discuss briefly what factors affect the microstructure a film grown on a substrate

Gas flux across concentration gradient: J=h(Cg-Cs ), Cs=concentration at surface Flux for chemical reaction: J(#/vol s)=k Cs, where k=koexp[-AG/(kBT)I Film growth velos/ hk ii where Nr is number of deposited species/cm Diffusio

1. You need to deposit a high quality (low electrical resistivity) Al film at a very high rate(v> I micron/min) and achieve good step coveage using sputter deposition. Referring to information in the class notes and text, answer the following three questions. (Grade will depend more on how you justify your design, rather than on its

Sputter deposition: Read Plummer Chap 9, Sections 9.2.2.2 to 9.3.10. Consider reading Ohring 1. You need to deposit a high quality (low electrical resistivity) Al film at a very high rate(v> I micron/min) and achieve good step coveage using sputter deposition

1.(Plummer 10.3)In a certain process, it is desired that the pitch of metal lines be equal to or less than 1.Omm(the pitch equals one metal linewidth plus one spacing between metal lines, measured at top of features). Assume that the metal linewidth and spacing are

All the questions are from Plummer, Chapter 10, p.679-680, which was handed out in class 1)Question 10.3 2) Question 10.4 3)Question 10.5 4) Question 10.6