I. Plot resolution and depth of field as a function of exposure wavelength for a projection aligner with 100nm< A <500nm. Assume NA=0.26. Recalculate on the same plot for NA=0.41. Discuss the implication of these plots for the technologist that must manufacture transistors with 0.5 um
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1)Plot resolution and depth of field as a function of exposure wavelength for a projection aligner with 100nm
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Problem 1 Deal-Grove model states that the thickness of the oxide is related to a time constant r and two constants A and b by the relation
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Solubility limit for P at 1273 K is Co 2 1 x 10 cm\. Intrinsic carrier concentration is 10 cm\. Thus, before including higher order terms, Do=13x10-4 cm2/s. But with first order and second order correction terms
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Diffusion: Read Plummer Chap. 7, sections 7.1-7.4,, 7.53, 7.5.8 Show that c(zt) Wroexpfzla)I,with a=2VDf, is a solution to Fick's second law of diffusion. ac(z, t) dc(zt) 2. a) What is the intrinsic carrier concentration in Si at 1100 C? b) Calculate the effective diffusivity (including first-order, charged-vacancy corrections)for As impurities in Si at 1100 C for two cases: 1)CAs=10 cm and ii)
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Due Sept 17. 2002 1. a) Mean free path 2= kBI d-p where k=1.38×102,T=293K,p=10mTor=133Pa,d=1A=100m 38×10-3(293 6.9cm ford=1A Jr(m)(332)017mfrd=2A b) Use the ideal gas law pV=nkB T 1.33Pa vk7(138×102X90)33×10m-33×10cm3
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Reading Assignment: Kinetics, Vac. Tech: Campbell, 10.1-1. 4(or Ohring Ch 2) 1. Consider a vacuum system at room temperature that has been pumped down to a 10 m-Torr with mostly nitrogen as determined from the residual gas analyzer. Make an in
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MEMS Mask layout Die leve Dark-field mask Dimensions are in micron
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Microelectronics Processing technology Fall Term 2003 Instructions for the microfluidics Lab report Your lab report should follow the format of the IEEE Electron Device Letters. The format from the IC and mEMs Lab reports will be used Contents: Your Letter should include the following sections y-line(Author, affiliation, and submission date)
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Microelectronics Processing technology Fall Term 2003 Instructions for the mems Lab report Your lab report should follow the format of the IEEE Electron Device Letters. The format from the IC Lab report will be used Contents: Your Letter should include the following sections
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西安交通大学:《芯片制造-半导体工艺实用教程》 第七章 氧化中国水利水电出版社:21世纪高等院校规划教材《DSP原理及应用》课程电子教案(PPT课件讲稿)第1章 绪论《电路》课程教学资源(电子教案)第十一章 三相电路电子科技大学:《白话通信与计算 Introduction to Communications and Computations》课程教学资源(课件讲稿)04 多址接入与功率控制《模拟电子技术》课程教学资源(PPT课件讲稿)10 直流电源上海交通大学:《通信基本电路》课程教学资源(讲义)§9.3 高电平调幅电路 9.3.1 集电极调幅电路 9.3.2 基极调幅 §9.4 调幅信号的解调电子科技大学:《现代网络理论与综合 Theory and Synthesize of Electric Network》课程教学资源(课件讲稿)第5讲 不定导纳函数《激光技术》教学资源(书籍文献)激光技术PDF电子书(共五部分二十七章)电子科技大学:《集成电子学 Integrated Electronics》课程教学资源(课件讲稿)第三章 VLSI集成物理(2/2)西安邮电大学:《现代通信网》课程教学课件(PPT讲稿)第一章 绪论电子科技大学:《数字信号处理 Digital Signal Processing》课程教学资源(课件讲稿)Chapter 10 Multirate Digital Signal Processing