《Microelectronics Process》lecture12

The process- Lab 2 KOH Undercut etch 20%,80C Fall 2003-MA schmidt 315516.152]- Lecture12-side6

The Process – Lab 2 „ KOH Undercut Etch „ 20%, 80C Fall 2003 – M.A. Schmidt 3.155J/6.152J – Lecture 12 – Slide 6

The process- Lab 3 Break the wafer into die Mount the die on a metal plate Test using the Hysitron Nanoindenter Fall 2003-MA schmidt 3.155J 6. 152]-Lecture 12-Slide 7

The Process – Lab 3 „ Break the wafer into die „ Mount the die on a metal plate „ Test using the Hysitron Nanoindenter F w Fall 2003 – M.A. Schmidt 3.155J/6.152J – Lecture 12 – Slide 7