STM32F103xCSTM32F103xDSTSTM32F103xEHigh-densityperformancelineARM-based32-bitMCUwith256to512KBFlash,USB,CAN,11timers,3ADCs,13communicationinterfacesFeatures■■Core:ARM32-bitCortexTM-M3CPUWLCSP6472MHzmaximumfrequencyLQFP6410×10mmLFBGA100 10×10mmLQFP10014×14mm,LFBGA14410×10mm1.25DMIPS/MHz (Dhrystone2.1)LQFP14420×20mmperformance at owait statememoryUpto112fast/Oportsaccess51/80/112I/Os,allmappableon16Single-cyclemultiplicationandhardwareexternalinterruptvectors andalmostalldivision5V-tolerantMemoriesUpto11timers256to512KbytesofFlashmemoryUp to four 16-bit timers, each with up to 4upto64KbytesofSRAMIC/OC/PwMorpulsecounterandFlexiblestaticmemorycontroller with4quadrature(incremental)encoderinputChipSelect.Supports Compact Flash,2×16-bit motor control PWM timerswithSRAM,PSRAM,NORandNANDmemoriesdead-time generation and emergency stopLCDparallelinterface,8080/6800modes2 ×watchdog timers (Independentand Clock,reset and supplymanagementWindow)2.0to3.6Vapplicationsupplyand/OsSysTick timer:a24-bitdowncounter-POR,PDR,andprogrammablevoltage2×16-bitbasictimerstodrivetheDACdetector (PVD)Upto13communicationinterfaces4-to-16MHz crystaloscillatorUp to2×/Pc interfaces (SMBus/PMBus)Internal8MHzfactory-trimmedRC-Upto5USARTs(ISO7816interface,LINInternal4okHzRCwithcalibrationIrDAcapability,modemcontrol)Upto3SPls (18Mbit/s),2with12s32kHzoscillatorforRTCwithcalibrationinterfacemultiplexedLowpowerCANinterface(2.0BActive)Sleep,StopandStandbymodes-USB2.0full speedinterfaceVBAT supplyforRTC and backup registersSDIOinterface3×12-bit, 1μsA/D converters (upto21CRC calculation unit,96-bit unique IDchannels)■ECOPACk? packagesConversion range:0 to3.6VTriple-sampleandholdcapabilityTable1.Device summaryTemperature sensorReferencePartnumber2×12-bitD/AconvertersDMA:12-channelDMAcontrollerSTM32F103RCSTM32F103VCSTM32F103xCSTM32F103ZCSupportedperipherals:timers,ADCs,DAC,SDIO,Ss,SPls,2CsandUSARTsSTM32F103RDSTM32F103VDSTM32F103xDSTM32F103ZDDebugmodeSTM32F103RESTM32F103ZESerial wire debug (SWD)& JTAG interfacesSTM32F103xESTM32F103VECortex-M3EmbeddedTraceMacrocellTMSeptember2009Doc ID14611Rev71/123www.st.com
September 2009 Doc ID 14611 Rev 7 1/123 1 STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features ■ Core: ARM 32-bit Cortex™-M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division ■ Memories – 256 to 512 Kbytes of Flash memory – up to 64 Kbytes of SRAM – Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories – LCD parallel interface, 8080/6800 modes ■ Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC with calibration – 32 kHz oscillator for RTC with calibration ■ Low power – Sleep, Stop and Standby modes – VBAT supply for RTC and backup registers ■ 3 × 12-bit, 1 µs A/D converters (up to 21 channels) – Conversion range: 0 to 3.6 V – Triple-sample and hold capability – Temperature sensor ■ 2 × 12-bit D/A converters ■ DMA: 12-channel DMA controller – Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs ■ Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M3 Embedded Trace Macrocell™ ■ Up to 112 fast I/O ports – 51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant ■ Up to 11 timers – Up to four 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input – 2 × 16-bit motor control PWM timers with dead-time generation and emergency stop – 2 × watchdog timers (Independent and Window) – SysTick timer: a 24-bit downcounter – 2 × 16-bit basic timers to drive the DAC ■ Up to 13 communication interfaces – Up to 2 × I2C interfaces (SMBus/PMBus) – Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control) – Up to 3 SPIs (18 Mbit/s), 2 with I2S interface multiplexed – CAN interface (2.0B Active) – USB 2.0 full speed interface – SDIO interface ■ CRC calculation unit, 96-bit unique ID ■ ECOPACK® packages Table 1. Device summary Reference Part number STM32F103xC STM32F103RC STM32F103VC STM32F103ZC STM32F103xD STM32F103RD STM32F103VD STM32F103ZD STM32F103xE STM32F103RE STM32F103ZE STM32F103VE FBGA LQFP64 10 × 10 mm, LQFP100 14 × 14 mm, LQFP144 20 × 20 mm LFBGA100 10 × 10 mm LFBGA144 10 × 10 mm WLCSP64 www.st.com
ContentsSTM32F103xC,STM32F103xD,STM32F103xEContents1Introduction92Description102.1Device overview112.214Full compatibility throughout the family2.315Overview2.3.1ARM?CortexTM-M3corewithembeddedFlashandSRAM.152.3.2.15EmbeddedFlashmemory2.3.3.15CRC (cyclicredundancycheck)calculationunit2.3.4..15EmbeddedSRAM2.3.5FSMC(flexiblestaticmemorycontroller).152.3.6LCDparallel interface.162.3.7.16Nestedvectored interruptcontroller(NVIC)2.3.8.16External interrupt/event controller (EXTI)2.3.9.16Clocksandstartup2.3.10Bootmodes.172.3.11Powersupplyschemes172.3.12Power supply supervisor172.3.13.17Voltage regulator2.3.14Low-powermodes.182.3.15DMA :.182.3.16.18RTC (real-timeclock)and backup registers2.3.17.19Timers andwatchdogs2.3.182cbus..202.3.19Universalsynchronous/asynchronousreceivertransmitters(USARTs)212.3.20Serial peripheral interface (SPI).212.3.21.21Inter-integrated sound (2s)2.3.22SDIO.21.212.3.23Controllerareanetwork (CAN)2.3.24.22Universal serialbus(USB)2.3.25GPIOs (general-purpose inputs/outputs).222.3.26ADC (analog to digital converter)222.3.27DAC (digital-to-analog converter).22.232.3.28TemperaturesensorS2/123Doc ID14611Rev7
Contents STM32F103xC, STM32F103xD, STM32F103xE 2/123 Doc ID 14611 Rev 7 Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.2 Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.1 ARM® Cortex™-M3 core with embedded Flash and SRAM . . . . . . . . . 15 2.3.2 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.3 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . 15 2.3.4 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.5 FSMC (flexible static memory controller) . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.6 LCD parallel interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.3.7 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 16 2.3.8 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . 16 2.3.9 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.3.10 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.11 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.12 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.13 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.14 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.3.15 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.3.16 RTC (real-time clock) and backup registers . . . . . . . . . . . . . . . . . . . . . . 18 2.3.17 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.3.18 I²C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.3.19 Universal synchronous/asynchronous receiver transmitters (USARTs) 21 2.3.20 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.21 Inter-integrated sound (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.22 SDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.23 Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.24 Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.25 GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.26 ADC (analog to digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.27 DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.28 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
STM32F103xC,STM32F103xD,STM32F103xEContents.232.3.29SerialwireJTAGdebugport(SWJ-DP)2.3.30EmbeddedTraceMacrocellT.23324Pinoutsandpindescriptions4.38Memorymapping5.39Electrical characteristics5.1:39Parameterconditions5.1.1.39Minimumandmaximumvalues5.1.2.39Typical values5.1.3..39Typical curves5.1.4Loading capacitor.395.1.5Pin input voltage..395.1.6Powersupplyscheme.405.1.7.40Current consumption measurement5.2Absolutemaximum ratings415.3.: 42Operating conditions5.3.1..42Generaloperatingconditions5.3.2..43Operatingconditionsatpower-up/power-down5.3.3Embeddedresetandpowercontrolblockcharacteristics..435.3.4.44Embedded reference voltage5.3.5.44Supply current characteristics5.3.6..54Externalclocksourcecharacteristics5.3.7Internalclocksourcecharacteristics.585.3.8PLLcharacteristics.605.3.9Memory characteristics..605.3.10FSMCcharacteristics.615.3.11EMCcharacteristics..805.3.12.81Absolute maximum ratings (electrical sensitivity)5.3.13.82/Oportcharacteristics5.3.14NRSTpincharacteristics.865.3.15..87TIMtimercharacteristics5.3.16Communicationsinterfaces.885.3.17CAN (controllerarea network) interface.975.3.1812-bitADCcharacteristics.985.3.19DACelectrical specifications103S3/123Doc ID14611Rev 7
STM32F103xC, STM32F103xD, STM32F103xE Contents Doc ID 14611 Rev 7 3/123 2.3.29 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.3.30 Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3 Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 43 5.3.3 Embedded reset and power control block characteristics . . . . . . . . . . . 43 5.3.4 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.3.5 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.3.6 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 5.3.7 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 5.3.8 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 5.3.9 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 5.3.10 FSMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 5.3.11 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 5.3.12 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 81 5.3.13 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 5.3.14 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 5.3.15 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 5.3.16 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 5.3.17 CAN (controller area network) interface . . . . . . . . . . . . . . . . . . . . . . . . . 97 5.3.18 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 5.3.19 DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
ContentsSTM32F103xC,STM32F103xD,STM32F103xE5.3.20105Temperaturesensorcharacteristics6Packagecharacteristics1066.1Packagemechanicaldata1066.2Thermal characteristics1146.2.1Referencedocument1146.2.2Selecting the product temperature range...115.7Part numbering1178Revision history118S4/123Doc ID14611Rev7
Contents STM32F103xC, STM32F103xD, STM32F103xE 4/123 Doc ID 14611 Rev 7 5.3.20 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 6.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 6.2 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 6.2.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 6.2.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . . 115 7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
STM32F103xC,STM32F103xD,STM32F103xEList oftablesList of tablesTable 1.Device summary...................Table 2.STM32F103xC,STM32F103xD and STM32F103xEfeatures and peripheral counts....11Table 3.STM32F103xxfamily.......14.19Table 4.High-densitytimerfeaturecomparisonTable 5..30High-densitySTM32F103xxpindefinitionsTable 6.....36FSMCpindefinitionTable 7..41Voltagecharacteristics41Table 8.Currentcharacteristics...42Table 9.Thermalcharacteristics.....42Table 10.General operatingconditions.43Table 11.Operatingconditionsatpower-up/power-down.43Table 12.Embeddedresetandpowercontrolblockcharacteristics.Table 13....44Embeddedinternal referencevoltage........Table 14.MaximumcurrentconsumptioninRunmode,codewithdataprocessing.45running from Flash....Table 15.Maximum currentconsumption in Run mode,code with data processing....45running from RAM.... .Table 16.Maximum current consumption in Sleep mode, code running from Flash or RAM.....47Table 17..48TypicalandmaximumcurrentconsumptionsinStopandStandbymodesTable 18.Typical currentconsumption inRunmode,codewithdataprocessing...51runningfromFlash........Table 19.Typical currentconsumptioninSleepmode,coderunningfromFlashor....52RAM......53Table 20.Peripheralcurrentconsumption.54Table 21.High-speedexternaluserclockcharacteristics..55Table 22.Low-speedexternaluserclockcharacteristics.56Table23.HSE4-16MHzoscillatorcharacteristics.Table 24.LSE oscillator characteristics (fsE= 32.768 kHz)......57.58Table 25.HSIoscillatorcharacteristics.Table 26.....59LSloscillatorcharacteristics.59Table 27.Low-powermodewakeuptimingsTable 28.PLLcharacteristics.....60.60Table 29.Flashmemorycharacteristics.Table 30..61Flash memory endurance and data retention. ....62Table31.Asynchronousnon-multiplexedSRAM/PSRAM/NORreadtimings.63Table 32.Asynchronousnon-multiplexedSRAM/PSRAM/NORwritetimings.64Table 33.AsynchronousmultiplexedPSRAM/NORreadtimings..Table 34..65AsynchronousmultiplexedPSRAM/NORwritetimings67Table 35.SynchronousmultiplexedNOR/PSRAMreadtimings..69Table 36.SynchronousmultiplexedPSRAMwritetimings..70Table 37.Synchronous non-multiplexed NOR/PSRAM read timings....71Table 38.Synchronous non-multiplexedPSRAMwrite timings....76Table 39.SwitchingcharacteristicsforPCCard/CFreadandwritecyclesTable 40..79SwitchingcharacteristicsforNANDFlashreadandwritecycles.80Table 41.EMScharacteristicsTable 42.EMIcharacteristics..81Table 43.ESDabsolutemaximumratings...81Table 44.Electricalsensitivities.82A5/123Doc ID14611Rev7
STM32F103xC, STM32F103xD, STM32F103xE List of tables Doc ID 14611 Rev 7 5/123 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. STM32F103xC, STM32F103xD and STM32F103xE features and peripheral counts . . . . 11 Table 3. STM32F103xx family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 4. High-density timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 5. High-density STM32F103xx pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 6. FSMC pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 7. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 8. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 9. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 10. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 11. Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 12. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 13. Embedded internal reference voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 14. Maximum current consumption in Run mode, code with data processing running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 15. Maximum current consumption in Run mode, code with data processing running from RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 16. Maximum current consumption in Sleep mode, code running from Flash or RAM. . . . . . . 47 Table 17. Typical and maximum current consumptions in Stop and Standby modes . . . . . . . . . . . . 48 Table 18. Typical current consumption in Run mode, code with data processing running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Table 19. Typical current consumption in Sleep mode, coderunning from Flash or RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Table 20. Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 21. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 22. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Table 23. HSE 4-16 MHz oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Table 24. LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table 25. HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Table 26. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Table 27. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Table 28. PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 29. Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 30. Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Table 31. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . . 62 Table 32. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . 63 Table 33. Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 34. Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table 35. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Table 36. Synchronous multiplexed PSRAM write timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Table 37. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 38. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Table 39. Switching characteristics for PC Card/CF read and write cycles . . . . . . . . . . . . . . . . . . . . 76 Table 40. Switching characteristics for NAND Flash read and write cycles . . . . . . . . . . . . . . . . . . . . 79 Table 41. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Table 42. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Table 43. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Table 44. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82