恩 低功耗系统设计 LiXi Computer Applications Lab CS Department,USTC
低功耗系统设计 Li Xi Computer Applications Lab CS Department, USTC
小米手机(MU),双核 USTC 主屏分辨率 480×854像素 自动 高 一低 42.0 主屏色彩 1600万色 40.7 30.9 网络模式 GSM,WCDMA 操作系统 MIUI+原生Android(基于Android OS v2.3.5) 核心数 双核 40.2 CPU型号 高通snapdragon QSD8260 CPU频率 1536MHZ GPU型号 高通Adreno220 29.0 机身内存 1GB RAM+4GB ROM 08129/2011 003751 存储卡 MicroSD卡 自动 扩展容量 32GB 高 低 °C44.0 42.1日30.9 电池容量 1930mAh 40.4 ·高温处？ -MSM8260 29.0 08129/2011 00:42:59
小米手机（MIUI），双核 • 高温处？ – MSM8260
Outline ·The Effects of Power ·Low Power Design -DPM based low power optimization -DVS based low power optimization ex:Program-level optimization for multimedia ACPI:OS supported PM 一软硬件协同低功耗设计 Power model:Power Analysis/Estimation Tek Tools Temperature Aware Design ·Leakage Power ·Case Study -Cache、Memory、Data Center、Handheld 。Conclusion llxx@ustc.edu.cn 3/62
Outline • The Effects of Power • Low Power Design – DPM based low power optimization – DVS based low power optimization • ex: Program-level optimization for multimedia – ACPI：OS supported PM llxx@ustc.edu.cn 3/62 – ACPI：OS supported PM – 软硬件协同低功耗设计 • Power model: Power Analysis/Estimation Tek & Tools • Temperature Aware Design • Leakage Power • Case Study – Cache、Memory、Data Center、Handheld • Conclusion
参考文献 POWER AWARE Power Aware Design Methodologies DESIGN METHODOLOGIES edited by M.Pedram and J.Rabaey, Kluwer Academic Publishers,2002. ●( Compilers and Operating Systems for uu=一 Low Power Compilers and Operating Systems for Low Power Benini,Luca;Kandemir,Mahmut; Ramanujam,J.(Eds.),Springer,2003, 246 p.,Hardcover Advanced Memory Optimization ck toLOOK INSIDE目 Techniques for Low-Power Embedded Processors Advanced Memory Jptimizanon lechniques Manish Verma,Peter Marwedel,Springer; or Low-Power Embedded Processors 1st edition (May 8,2007) llxx@ustc.edu.cn 4/62
参考文献 • Power Aware Design Methodologies – edited by M. Pedram and J. Rabaey, Kluwer Academic Publishers, 2002. • Compilers and Operating Systems for Low Power – Benini, Luca; Kandemir, Mahmut; llxx@ustc.edu.cn 4/62 Ramanujam, J. (Eds.) , Springer, 2003, 246 p., Hardcover • Advanced Memory Optimization Techniques for Low-Power Embedded Processors – Manish Verma, Peter Marwedel, Springer; 1st edition (May 8, 2007)
Power Constraint:heat dissipation limited systems High-end systems,e.g.servers,stations and desktops Cooling and packaging cost Reliability requires System Power Consumption evey10℃increase on Athion 64 3500+90nm Athlon 64 3500+130nm relative operating temperature ■Pentium43.4GHz90nn MTBF double failure rate for the 112 131 1下 components 151 0.8 151 Sphinx 179 0.6 233 0.4 146 Moldyn 175 0.2 230 0 151 Xmpeg 179 707580859095100105 236 source:Intel Components Quality Temp 50 100 150 200 250 and Reliability Handbook Watts llxx@ustc.edu.cn 5/62
Power Constraint：heat dissipation limited systems • High-end systems, e.g. servers, stations and desktops – Cooling and packaging cost – Reliability requires relative MTBF every 10℃ increase on operating temperature double failure rate for the llxx@ustc.edu.cn 5/62 Temp MTBF 0 0.2 0.4 0.6 0.8 1 70 75 80 85 90 95 100 105 source: Intel Components Quality and Reliability Handbook double failure rate for the components