STM32L431xx List of figures Figure 47.UFBGA100-100-ball.7x7mm.0.50mm pitch,ultra fine pitch ball grid age recommended footprint e quad flat package outline Figure 50. LQFP64-64-pin.10 x 10 mm low-profile quad flat package ended footprint.. 186 UFBGA6464-blx5mm.0.5 mm pitch ultra profile fine pitch ball grid Figure53. Ealmm.mm pitch ulitra pro ine pitch ball grid 185 array pac 18 .188 Figure56. WLCSP64-64-ball.3.141x3.127mm.0.35 mm pitch wafer level chip scale Figure 57. WLCSP64 markin view) 18 Figure 58. WLCSP49-49-ball.1413.127mm.04 mm pitch water levei chip scale Figure 59. WLCSP49-49-ball.3.141x 3.127 mm.0.4 mm pitch wafer level chip scale 191 Pcte0eewencedtoop27 quad flat package outline Figure 62. LQFP48-48-pin,7x7 mm low-profile quad flat package LOFP48 marking ton viow 188 Figure 64. UFQFPN48-48-lead,7x7 mm,0.5 mm pitch,ultra thin fine pitch quad fiat 197 Figure65. package re comn ended footprint 32-pin5x5 mm 186 mm plt package outlin Figure68. N32-3-in5x5mm..5mm pitch ultra thin fine pitch quad fat .199 Figure 69. UFOFPN32 marking (package top view) 201 202 Figure 70. LQFP64 Pp max vs.TA..................................................205 7 DS11453 Rev3 11208
DS11453 Rev 3 11/208 STM32L431xx List of figures 11 Figure 47. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 Figure 48. UFBGA100 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 Figure 49. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 183 Figure 50. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184 Figure 51. LQFP64 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Figure 52. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Figure 53. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 Figure 54. UFBGA64 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 Figure 55. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 Figure 56. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 Figure 57. WLCSP64 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 Figure 58. WLCSP49 - 49-ball, 3.141 x 3.127 mm, 0.4 mm pitch wafer level chip scale package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191 Figure 59. WLCSP49 - 49-ball, 3.141 x 3.127 mm, 0.4 mm pitch wafer level chip scale package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 Figure 60. WLCSP49 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 Figure 61. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 194 Figure 62. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 Figure 63. LQFP48 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 Figure 64. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197 Figure 65. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198 Figure 66. UFQFPN48 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 Figure 67. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 Figure 68. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201 Figure 69. UFQFPN32 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 Figure 70. LQFP64 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
Introduction STM32L431xx 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32L431xx microcontrollers. This document should be read in coniunction with the STM32L43xxx/44xxx/45xxx/46xxx RcewemmhseicaeeaaeegoecoaeMatniea arm a.Amisa registered trademark of Arm Limited (subsidiaries)in theUS and/or elsewhere 12/208 DS11453 Rev 3 7
Introduction STM32L431xx 12/208 DS11453 Rev 3 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32L431xx microcontrollers. This document should be read in conjunction with the STM32L43xxx/44xxx/45xxx/46xxx reference manual (RM0394). The reference manual is available from the STMicroelectronics website www.st.com. For information on the Arm®(a) Cortex®-M4 core, please refer to the Cortex®-M4 Technical Reference Manual, available from the www.arm.com website. a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere
STM32L431xx Description 2 Description The STM32evice thrcohigh PeoconegM4CcorgearesHF6an10cnoeer9ngepreesowcWs0pesa Am 2enprecsiondatapr0ce sing instructions and ata types.It also implements a ful tructions and a memory protection unit(MPU)which enhances application an extensive ran e of enhand ed Os and peripherals connected to two o AHB buses and a 32-bit multi-AHB bus matrix. The STM321431xx devices embed several n bedded Flash memory and SRAM:readout protection,write protection,proprietary code readout protection and Firewall. The devices offer a fast 12-bit ADc(5 Msps).two comparators.one o rational amplifier two DAC chi our general-purpose In addition,up to 21 capacitive sensing channels are available. They also feature standard and advanced communication interfaces Three SPIs Three US ARTs and one Low-Power UART One SAI (Serial Audio Interfaces) One SDMMC One CAN .One SWPMI(Single Wire Protocol Master Interface) Acomprehensive set ofraving modes all the desin of registers The STM32L431xx family offers nine packages from 32 to 100-pin packages Table 2.STM32L431xx family device features and peripheral counts Peripheral STM32L431VxSTM32L431Rx STM32L431Cx STM32L431Kx Flash memory 256KB 128KB256KB128KB256KB128KB256KB SRAM 64KB Quad SPI Yes 7 DS11453 Rev 3 13/208
DS11453 Rev 3 13/208 STM32L431xx Description 54 2 Description The STM32L431xx devices are the ultra-low-power microcontrollers based on the highperformance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The STM32L431xx devices embed high-speed memories (Flash memory up to 256 Kbyte, 64 Kbyte of SRAM), a Quad SPI flash memories interface (available on all packages) and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix. The STM32L431xx devices embed several protection mechanisms for embedded Flash memory and SRAM: readout protection, write protection, proprietary code readout protection and Firewall. The devices offer a fast 12-bit ADC (5 Msps), two comparators, one operational amplifier, two DAC channels, an internal voltage reference buffer, a low-power RTC, one generalpurpose 32-bit timer, one 16-bit PWM timer dedicated to motor control, four general-purpose 16-bit timers, and two 16-bit low-power timers. In addition, up to 21 capacitive sensing channels are available. They also feature standard and advanced communication interfaces. • Three I2Cs • Three SPIs • Three USARTs and one Low-Power UART. • One SAI (Serial Audio Interfaces) • One SDMMC • One CAN • One SWPMI (Single Wire Protocol Master Interface) The STM32L431xx operates in the -40 to +85 °C (+105 °C junction), -40 to +105 °C (+125 °C junction) and -40 to +125 °C (+130 °C junction) temperature ranges from a 1.71 to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of lowpower applications. Some independent power supplies are supported: analog independent supply input for ADC, DAC, OPAMP and comparators. A VBAT input allows to backup the RTC and backup registers. The STM32L431xx family offers nine packages from 32 to 100-pin packages. Table 2. STM32L431xx family device features and peripheral counts Peripheral STM32L431Vx STM32L431Rx STM32L431Cx STM32L431Kx Flash memory 256KB 128KB 256KB 128KB 256KB 128KB 256KB SRAM 64KB Quad SPI Yes
Description STM32L431xx Table 2.STM32L431xx family device features and peripheral counts(continued) Peripheral STM32L431VxSTM32L431Rx STM32L431Cx STM32L431KX 1(16-bi0 2116-bi0 1132.bm Basic 2(16-bi0 Timers 2(16-bi0 Watchdo window SPI 3 2 3 2 USART LPUART 1 1 SAl CAN SDMMC Yes No SWPMI Yes RTC Yes Tamper pins 3 2 1 Random generator GPIOs 38or390 Wakeup pins 3 Capacitive sensing Number of channels 21 2 12-bit ADC 1 Number of channels 10 12-bit DAC channels No Analog comparator 2 1 Max.CPU frequency 80 MHz Operating voltage 1.71to3.6V 14/208 DS11453 Rev 3 7
Description STM32L431xx 14/208 DS11453 Rev 3 Timers Advanced control 1 (16-bit) General purpose 2 (16-bit) 1 (32-bit) Basic 2 (16-bit) Low - power 2 (16-bit) SysTick timer 1 Watchdog timers (indepen dent, window) 2 Comm. interfaces SPI 3 2 I 2C3 2 USART LPUART 3 1 2 1 SAI 1 CAN 1 SDMMC Yes No SWPMI Yes RTC Yes Tamper pins 3 2 2 1 Random generator Yes GPIOs Wakeup pins 83 5 52 4 38 or 39(1) 3 26 2 Capacitive sensing Number of channels 21 12 6 3 12-bit ADC Number of channels 1 16 1 16 1 10 1 10 12-bit DAC channels 2 Internal voltage reference buffer Yes No Analog comparator 2 Operational amplifiers 1 Max. CPU frequency 80 MHz Operating voltage 1.71 to 3.6 V Table 2. STM32L431xx family device features and peripheral counts (continued) Peripheral STM32L431Vx STM32L431Rx STM32L431Cx STM32L431Kx
STM32L431xx Description Table 2.STM32L431xx family device features and peripheral counts(continued) Peripheral STM32L431VxSTM32L431Rx STM32L431Cx STM32L431Kx mbient opera JFBGA100 UFQFPN32 UERGA64 UFQFPN48 For WLCSP49 package. 7 DS11453 Rev 3 15/208
DS11453 Rev 3 15/208 STM32L431xx Description 54 Operating temperature Ambient operating temperature: -40 to 85 °C / -40 to 105 °C / -40 to 125 °C Junction temperature: -40 to 105 °C / -40 to 125 °C / -40 to 130 °C Packages LQFP100 UFBGA100 WLCSP64 LQFP64 UFBGA64 WLCSP49 LQFP48 UFQFPN48 UFQFPN32 1. For WLCSP49 package. Table 2. STM32L431xx family device features and peripheral counts (continued) Peripheral STM32L431Vx STM32L431Rx STM32L431Cx STM32L431Kx