Processes: gift of Slo2-Expose Si to steam = uniform insulating layer or metal film growth: high vacuum, single element Contrast with CVD: toxic, corrosive gas flowing through valves

What does Materials Science have to do with Microelectronic Processing? Need to understand DIfferences: metals, oxides and semiconductors Atomic bonding Oxidation rates

What does Materials Science have to do with Microelectronic Processing? Need to understand DIfferences: metals, oxides and semiconductors Atomic bonding Oxidation rates, compound formation(GaAs)

8.1差错控制编码的基本概念 8.1.1差错控制方式 图8-1差错控制系统

7.1进制数字调制 7.1.1二进制幅度键控(2ASK)

6.1数字基带信号的码型 6.1.1数字基带信号的码型设计原则 6.1.2二元码

5.1脉冲编码调制(PCM) 5.1.1脉冲编码调制的基本原理

第4章模拟角调制 4.1角调制的基本概念

3.1双边带调幅 3.1.1常规调幅(AM)

2.1信号和系统的分类 2.1.1信号的分类 2.1.2系统的分类