Thin Film Deposition · Physical Vapor Deposition(PVD)- Evaporation蒸发 Vaporize a metal target using thermal energy low pressure An Evaporation system includes the following High vacuum chamber and high vacuum components Evaporation source: Filament, Electron beam, or Flash hot plate Evaporation is Inferior to Sputtering Difficult to do alloys Step coverage Adhesion Evaporation is mostly used today for backside processing only zhang@fudan.edu.cn复旦大学张荣君
rjzhang@fudan.edu.cn 复旦大学 张荣君 Thin Film Deposition • Physical Vapor Deposition (PVD) – Evaporation蒸发: – Vaporize a metal target using thermal energy @ low pressure • An Evaporation system includes the following: – High vacuum chamber and high vacuum components – Evaporation source: Filament, Electron beam, or Flash hot plate • Evaporation is Inferior to Sputtering: – Difficult to do alloys – Step coverage – Adhesion • Evaporation is mostly used today for backside processing only
Thin Film Deposition Physical Vapor Deposition(PVD)-Evaporation Why step coverage is even worse with evaporation than sputtering Sputter: Target Evaporation rge zhang@fudan.edu.cn复旦大学张荣君
rjzhang@fudan.edu.cn 复旦大学 张荣君 Thin Film Deposition • Physical Vapor Deposition (PVD) – Evaporation: – Why step coverage is even worse with evaporation than sputtering
Thin Film deposition Evaporation System 0 AL EVAP ducn复旦大学张荣君
rjzhang@fudan.edu.cn 复旦大学 张荣君 Thin Film Deposition • Evaporation System:
Thin Film Deposition · Evaporation Systen- Filament灯丝 Aluminum Vapor Filament Magnet Aluminu Water Cooled Copper Crucible 八其术石
rjzhang@fudan.edu.cn 复旦大学 张荣君 Thin Film Deposition • Evaporation System – Filament 灯丝:
Thin Film Deposition Evaporation System -Hot Plate Aluminum apor Aluminum Alloy Wire Hot Plate
rjzhang@fudan.edu.cn 复旦大学 张荣君 Thin Film Deposition • Evaporation System - Hot Plate: