影响金属导电性的因素 电阻率 散射 Ptotal=Pt +Pi Pd Scattering events 温度: thermal vibration 杂质: solid solution 塑性形变: dislocation Net electron motion
影响金属导电性的因素 电阻率 温度: thermal vibration 杂质: solid solution 塑性形变: dislocation 散射
Temperature°F) FIGurE 12. 8 The 400 300 -200 100 0 +100 electrical resistivity versus temperature for copper and three copper-nickel Cu +3.32 at% Ni alloys, one of which has 5 been deformed. Thermal impurity, and deformation contributions to the Cu +2.16 at% Ni resistivity are indicated at 100°C.| Adapted from J O. Linde, Ann. Physik, 5 Deformed 219(1932);andC.A Wert and r.m. thomson Cu +1.12 at% Ni Physics of Solids, 2nd edition. McGraw-Hill Book cor New York. 1970 Pure coppel 250 -200 150 100 +50 Temperature(°C)
(2)绝缘体 insulator 电子局域:离子键 共价键 FIGURE 12. 6 Fre electro Electr excitation = Hole in valence al
（2）绝缘体 insulator 电子局域：离子键 共价键
Table 12. 3 Typical Room-Temperature Electrical Conductivities for 13 Nonmetallic materials Electrical Conductivity Material I(Q2-m)"I Graphite 3×104-2×105 ramiCs Concrete(dry) 10-9 oda-lime glass 10-10-10-1 Porcelain 10-10-10-12 Borosilicate glass ~10-13 Aluminum oxide <10-13 Fused silica <10-18 Polymers Phenol-formaldehyde 10-9-10-10 Polymethyl methacrylate <10-12 Nylon 6,6 10-12-10-13 Polystyrene <10 14 Polyethylene 10 -15 17 Polytetrafluoroethylene <10-17