rnating Current Overhead: Line Parameters, 61.1 Alternating Models, Standard Voltages, Insulators ine Line Parameters. Models- Standard Voltages.Insulators Mo-Shing Chen 61.2 Alternating Current Underground: Line Parameters, University of Texas at Arlington Models, Standard Voltages, Cables Cable Parameters.Models. Standard Voltages. CableStandards K.C. Lai 61.3 High-Voltage Direct-Current Transmission

80.1 Integrated Circuits(RAM, ROM) Dynamic RAMs(DRAMs). Static RAMs(SRAMs).Nonvolatile Programmable Memories. Read-Only Memories(ROMs) W. David Pricer 80.2 Basic Disk System Architectures IBM Basic Magnetic Disk System Architecture.Characterization of 1/0 Workloads. Extensions to Conventional Disk Architectures Randy H. Katz

79.1 IC Logic Family Operation and Characteristics IC Logic Families and Subfamilies TTL Logic Family .CMOS Gregory L. Moss Logic Family ECL Logic Family Logic Family Circuit Parameters. Interfacing Between Logic Families

78.1Introduction 78.2 The Role of Simulation 78.3 Motivation for the Use of Simulation 78.4 Limitations of Simulation 78.5 Simulation Structure 78.6 The Interdisciplinary Nature of Simulation 78.7 Model Design

77.1 Introduction to Telemetry 77.2 Measuring and Transmitting 77.3 Applications of Telemetry Power Sources. Power Plants 77.4 Limitations of Telemetry 77.5 Transmitters and Batteries 77.6 Receivers and Discriminators 77.7 Antennas and Total System

76.1Introduction 76.2 Loop Filter 76.3Noise 76.4 PLL Design Procedures Steven L. Maddy 76.5Components RLM Research 76.6 Applications

75.1 Mobile Radio and Cellular Communications cation and The Difference between Fixed-to-Fixed Radio Communication an Mobile Communication-Natur tural Problems in Mobile Radio Communications. Description of Mobile Radio Systems

为做好3G引入前期的技术准备工作,进一步调动员工学习钻研3G技术的 积极性,最大限度地使员工掌握全面的3G相关技术知识,培养技术精、作风硬 的3G技术骨干队伍,不断提升中移动技术应用与创新的能力,增强企业核心竞 争力。在集团公司已经系统组织的3G技术知识培训基础上,集团公司技术部组 织相关部门编写了这本3G技术知识培训手册,便于全国的规划、建设、维护、 优化和支撑等技术人员进行3G技术知识的系统化学习同时,该手册也是作为 集团公司即将举办的3G技术知识竞赛的培训读本

随着大规模集成电路和计算机技术的飞速发展,数字信号处理(DSP)技术已经渗 透到几乎各个领域,包括计算机语音学、计算机视觉、计算机多媒体技术、超文本 数据传输等各个领域,而用于进行数字信号处理的专用DSP芯片的性能价格比也在 惊人地增加。目前DSP的主要生产厂家有 Analog Devices,inc.公司、 Texas Instruments 公司、AT&T、 Motorala公司、NEC公司等,而笔者认为在诸多DSP生产厂家中, TI公司和ADI公司是比较突出的,他们将以其产品的独特性而成为DSP芯片市场 的主要领导者之一

第一节协议概念与层次结构 第二节S1开放系统互连参考模型 第三节层间通信 第四节CCⅩ系列建议的主要概况 第五节 CCITT25建议 第六节分组装/拆(PAD)功能及相关协议 第七节公用分组交换网的互连协议一X.75建议