高级计算机体系结构设计及其在数据中心和云计算的应用HardwareModificationsforSMpProcessor-MemoryinterfaceMotherboard-Multiplesockets (oneperCPU)- Datapaths between CPUs and memoryOther- Case:larger (biggermotherboard,betterairflow)-Power:biggerpowersupplyforNCPUs-Cooling:morefans to removeN CPUs'worthofheat
高级计算机体系结构设计及其在数据中心和云计算的应用 Hardware Modifications for SMP • Processor – Memory interface • Motherboard – Multiple sockets (one per CPU) – Datapaths between CPUs and memory • Other – Case: larger (bigger motherboard, better airflow) – Power: bigger power supply for N CPUs – Cooling: more fans to remove N CPUs’ worth of heat
高级计算机体系结构设计及其在数据中心和云计算的应用g (CMP)Chip-MultiprocessingSimpleSMPonthesamechip-CpUsnow called“cores"byhardwaredesigners-OSdesigners still call these“"cPUs"SystemBusBTB&I-TLBBTB&I-TLBDecoderDecoderTrace CacheTraceCache9Rename/AllocRename/AllocuopQueuesuopQueuesSchedulersschedulerIntegerRFnteneL1D-Cacheand D-TLBL1D-CacheandD-TLEIntel"SmithfieldBlockDiagramAMDDual-CoreAthlonFX
高级计算机体系结构设计及其在数据中心和云计算的应用 Chip-Multiprocessing (CMP) • Simple SMP on the same chip – CPUs now called “cores” by hardware designers – OS designers still call these “CPUs” Intel “Smithfield” Block Diagram AMD Dual-Core Athlon FX