Thermally Advantaged Chassis (TAC) Design Guide February 2008 Revision 2.0
Thermally Advantaged Chassis (TAC) Design Guide February 2008 Revision 2.0
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELR PRODUCTS.NO LICENSE,EXPRESS OR IMPLIED,BY ESTOPPEL OR OTHERWISE.TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,INTEL ASSUMES NO LIABILITY WHATSOEVER,AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY.RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,MERCHANTABILITY,OR INFRINGEMENT OF ANY PATENT,COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL,THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time,without notice. Designers must not rely on the absence or characteristics of any features or instructions marked 'reserved"or "undefined."Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.The information here is subject to change without notice.Do not finalize a design with this information. The Intel logo is a trademark of Intel Corporation in the U.S.and other countries. Copyright 2008,Intel Corporation.All rights reserved
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The Intel logo is a trademark of Intel Corporation in the U.S. and other countries. Copyright © 2008, Intel Corporation. All rights reserved
intel Contents 1 Introduction...................... 5 1.1 SC0pe… 1.2 0 verview… 5 1.3 Recommended Chassis Type................... 6 1.4 Reference Documents................. 6 2 2.7 2.1 Thermally Advantaged Chassis Description............................... 2.2 Thermally Advantaged Chassis Typical Airflow Pattern........................ 8 2.3 System Fans.… .9 2.4 TAC 2.0 Vent Size and Location........................... …10 3 Dynamics.... .11 3.1 Shock Test.… ..11 3.2 Vibration Test.… .11 3.3 Pass criteria.... .11 4 Regulatory Considerations... .12 4.1 Electromagnetic Interference Radiation...... ….12 4.2 Safety… .13 4.3 Ecology. 13 5 Mechanical Drawings............... ...14 Figures Figure 1.Typical Tower Platform With Optimized Side Vent............................ 7 Figure 2.Thermally Advantaged Chassis Typical Airflow Pattern ...............................8 E34579/TAC 2.0 Design Guide 3
E34579 / TAC 2.0 Design Guide 3 Contents 1 Introduction ...................................................................................................... 5 1.1 Scope.................................................................................................... 5 1.2 Overview ............................................................................................... 5 1.3 Recommended Chassis Type .................................................................... 6 1.4 Reference Documents.............................................................................. 6 2 Section 2 .......................................................................................................... 7 2.1 Thermally Advantaged Chassis Description................................................. 7 2.2 Thermally Advantaged Chassis Typical Airflow Pattern ................................. 8 2.3 System Fans .......................................................................................... 9 2.4 TAC 2.0 Vent Size and Location ...............................................................10 3 Dynamics ........................................................................................................11 3.1 Shock Test ............................................................................................11 3.2 Vibration Test........................................................................................11 3.3 Pass Criteria..........................................................................................11 4 Regulatory Considerations .................................................................................12 4.1 Electromagnetic Interference Radiation ....................................................12 4.2 Safety ..................................................................................................13 4.3 Ecology ................................................................................................13 5 Mechanical Drawings .........................................................................................14 Figures Figure 1. Typical Tower Platform With Optimized Side Vent ..................................... 7 Figure 2. Thermally Advantaged Chassis Typical Airflow Pattern .............................. 8
Revision History Revision Description Revision Date Number 1.0 Initial release.Chassis Air Guide(CAG)Design Guide May 2002 1.1 System vent pattern optimization.Chassis Air Guide(CAG) September 2003 Design Guide 2.0 Re-design to accommodate 2009 platforms.Document title February 2008 renamed to Thermally Advantaged Chassis(TAC)2.0 to reflect the elimination of the CAG side duct
Revision History Revision Number Description Revision Date 1.0 Initial release. Chassis Air Guide (CAG) Design Guide May 2002 1.1 System vent pattern optimization. Chassis Air Guide (CAG) Design Guide September 2003 2.0 Re-design to accommodate 2009 platforms. Document title renamed to Thermally Advantaged Chassis (TAC) 2.0 to reflect the elimination of the CAG side duct. February 2008
Introduction intel 1 Introduction 1.1 Scope This design guide explores the design and performance of a generic airflow management scheme to adequately cool the internal components of a personal computer.Design recommendations are presented for implementation within mid- tower and mini-tower desktop style enclosures.The target audiences for this document are:computer enclosure engineers,designers,and system integrators. 1.2 Overview In order to facilitate next generation PC platform designs for 2009 and beyond,it has become necessary to alter the physical location of the processor relative to previous platform generations.Earlier versions of the Chassis Air Guide(CAG)Design Guide presented a reference airflow management scheme that was dependant on a relatively consistent location of the processor.The TAC 2.0 design guide accommodates this change in processor location and provides backward compatibility to previous PC platform generations. Improvements in processor architecture design and reductions in transistor leakage have resulted in more efficient processors that consume less power with better performance than earlier generations.The goal of previous CAG Design Guide versions was to define a means to limit the processor inlet temperature to a maximum of 38 C to allow for the use of cost effective processor cooling devices.With the improvements in latest generation processor designs and performance it is possible to design cost effective processor cooling solutions with a higher inlet temperature.Therefore,In addition to eliminating processor location dependency,the TAC 2.0 Design Guide also defines a new processor cooling solution inlet temperature target of 40 C. The scope of the previous CAG Design Guide was centered on an enclosure side duct that delivered cooler external air directly to the processor fan heatsink.This revised design guide eliminates the duct and relies solely on optimized chassis venting and airflow management.This not only eliminates the above mentioned processor location dependency but also allows for PC enclosure cost reduction when compared to previous CAG Design Guide versions. Proper thermal management of PC enclosure design is critical to the performance and functionality of internal PC components as well as achieving desirable acoustic noise levels.There are many different ways to provide proper chassis thermal management. The design approach described in the document is one such method that if implemented correctly will provide a single,cost effective solution for a wide range of PC platform generations. E34579/TAC 2.0 Design Guide 5
Introduction E34579 / TAC 2.0 Design Guide 5 1 Introduction 1.1 Scope This design guide explores the design and performance of a generic airflow management scheme to adequately cool the internal components of a personal computer. Design recommendations are presented for implementation within midtower and mini-tower desktop style enclosures. The target audiences for this document are: computer enclosure engineers, designers, and system integrators. 1.2 Overview In order to facilitate next generation PC platform designs for 2009 and beyond, it has become necessary to alter the physical location of the processor relative to previous platform generations. Earlier versions of the Chassis Air Guide (CAG) Design Guide presented a reference airflow management scheme that was dependant on a relatively consistent location of the processor. The TAC 2.0 design guide accommodates this change in processor location and provides backward compatibility to previous PC platform generations. Improvements in processor architecture design and reductions in transistor leakage have resulted in more efficient processors that consume less power with better performance than earlier generations. The goal of previous CAG Design Guide versions was to define a means to limit the processor inlet temperature to a maximum of 38 °C to allow for the use of cost effective processor cooling devices. With the improvements in latest generation processor designs and performance it is possible to design cost effective processor cooling solutions with a higher inlet temperature. Therefore, In addition to eliminating processor location dependency, the TAC 2.0 Design Guide also defines a new processor cooling solution inlet temperature target of 40 °C. The scope of the previous CAG Design Guide was centered on an enclosure side duct that delivered cooler external air directly to the processor fan heatsink. This revised design guide eliminates the duct and relies solely on optimized chassis venting and airflow management. This not only eliminates the above mentioned processor location dependency but also allows for PC enclosure cost reduction when compared to previous CAG Design Guide versions. Proper thermal management of PC enclosure design is critical to the performance and functionality of internal PC components as well as achieving desirable acoustic noise levels. There are many different ways to provide proper chassis thermal management. The design approach described in the document is one such method that if implemented correctly will provide a single, cost effective solution for a wide range of PC platform generations