Pentium龙片内的主要功能块 Le Die Area: 91 mm2 w直径8imch(200m)的 Wafer最多可做196个De 3,300,000 Transistors Cache:≈ M Transistors 296 Pins 北京大学计算机科学技术系 计算机系统结构教研室
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PentⅰumPr0芯片内的主要功能块 Die area: 306 mm2 直径8imch200mm)的 Wafer最多可做78个De 5,500000 Transistors Cache::lM Transistors External cache 31M Transistors w Pentium Pro Package E Hie PentiumPro+ ExternalCachel 387 Pins 北京大学计算机科学技术系 计算机系统结构教研室
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集成电路的成本 Wafer cost Die cost= Dies per wafer x Die yield Wafer area Dies per wafer e area T x(Wafer diameter /2) Die area 考虑 Wafer的边界问题(等价于“ Square pegs in a round hole” probelm后 nX(Wafer_diameter /2) TX Wafer diameter Dies per wafer Die area 2× Die area 北京大学计算机科掌技术系 计算机系统结构教研室
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集成电路的成本 Die_ yield =Wafer_ yield x 1+ Defects per unit area x die area Defects per unit area is a measure of the random and manufacturing defects that occur. In 1995, these values typically range between 0.6 to 1.2 per square centimeter, depending on the maturity of the process a is a parameter that corresponds roughly to the number of masking levels, a measure of manufacturing complexity, critical to die yield. For today's multilevel metal CMOS processes, a good estimate is a=3. 0. In the following, we assume the wafer yield is 100%, 北京大学计算机科学技术系 计算机系统结构教研室
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集成电路的成本 Die cost= Wafer cost Dies per wafer x Die yield Wafer area Dies per wafer= le area Defects per unit area x die area Die vield =1+ Wafer cost Die cost W afer area Die_area ((1+ Defects_ per_area x Die_area/a) Wafer cost Die area(+ Defects per- area Die area/a)o Wa afer area f(Die-area jon) 北京大学计算机科掌技术系 计算机系统结构教研室
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