1)Plot resolution and depth of field as a function of exposure wavelength for a projection aligner with 100nm
文件格式: PDF大小: 76.16KB页数: 1
Problem 1 Deal-Grove model states that the thickness of the oxide is related to a time constant r and two constants A and b by the relation
文件格式: PDF大小: 267.12KB页数: 3
Solubility limit for P at 1273 K is Co 2 1 x 10 cm\. Intrinsic carrier concentration is 10 cm\. Thus, before including higher order terms, Do=13x10-4 cm2/s. But with first order and second order correction terms
文件格式: PDF大小: 528.88KB页数: 4
Diffusion: Read Plummer Chap. 7, sections 7.1-7.4,, 7.53, 7.5.8 Show that c(zt) Wroexpfzla)I,with a=2VDf, is a solution to Fick's second law of diffusion. ac(z, t) dc(zt) 2. a) What is the intrinsic carrier concentration in Si at 1100 C? b) Calculate the effective diffusivity (including first-order, charged-vacancy corrections)for As impurities in Si at 1100 C for two cases: 1)CAs=10 cm and ii)
文件格式: PDF大小: 160.66KB页数: 2
Due Sept 17. 2002 1. a) Mean free path 2= kBI d-p where k=1.38×102,T=293K,p=10mTor=133Pa,d=1A=100m 38×10-3(293 6.9cm ford=1A Jr(m)(332)017mfrd=2A b) Use the ideal gas law pV=nkB T 1.33Pa vk7(138×102X90)33×10m-33×10cm3
文件格式: PDF大小: 60.62KB页数: 6
Reading Assignment: Kinetics, Vac. Tech: Campbell, 10.1-1. 4(or Ohring Ch 2) 1. Consider a vacuum system at room temperature that has been pumped down to a 10 m-Torr with mostly nitrogen as determined from the residual gas analyzer. Make an in
文件格式: PDF大小: 29.12KB页数: 2
MEMS Mask layout Die leve Dark-field mask Dimensions are in micron
文件格式: PDF大小: 25.27KB页数: 1
Microelectronics Processing technology Fall Term 2003 Instructions for the microfluidics Lab report Your lab report should follow the format of the IEEE Electron Device Letters. The format from the IC and mEMs Lab reports will be used Contents: Your Letter should include the following sections y-line(Author, affiliation, and submission date)
文件格式: PDF大小: 78.54KB页数: 1
Microelectronics Processing technology Fall Term 2003 Instructions for the mems Lab report Your lab report should follow the format of the IEEE Electron Device Letters. The format from the IC Lab report will be used Contents: Your Letter should include the following sections
文件格式: PDF大小: 93.41KB页数: 2
In this lab session, the cantilever and fixed-fixed beams will be mechanically tested to determ material and device performance characteristics. The structures will be mechanically loaded the corresponding deflection measured. From the load versus deflection curves, an effective
文件格式: PDF大小: 25.51KB页数: 2
《信号分析与处理》课程教学资料(书籍教材)信号分析与处理(PDF电子版)MATLAB 语言及应用(共七章,含附录)电子科技大学:《试验设计方法》讲稿《电路》课程教学资源(A)习题解答_第4章 电路定理电子科技大学:《试验设计方法》教师教案《SDH技术》 技术的产生和特点课件讲解《数字电》英文版 chapter3-1 Combinational logic Circuits宁夏师范学院:《数字电路》课程教学资源(PPT课件)第八章 模数转换电路(数模和模数转换器)《数字电路与逻辑设计》课程实验指导(数字电路实验)实验八 移位寄存器及其应用《数字电子技术》课程PPT教学课件(非电类)第5章 触发器《微波技术基础 Fundamentals of Microwave Technology》课程教学资源(书籍文献)微波工程中文版(第3版)pozar,电子工业出版社《数字电子技术》课程PPT教学课件课件(电类)第03章 逻辑门电路 3.2 TTL逻辑门










