上海究大学 Logical vs Physical Connectivity and the SHANGHAI JIAO TONG UNIVERSITY relationship to Subsystem Layering Application Layer Application Layer Presentation Layer Presentation Layer Logical Session Layer Session Layer Connectivity Bidirectional associa-tions for Layers each layer Transport Layer Transport Layer Network Layer Network Layer Data Link Layer Data Link Layer Physical Physical Layer Physical Layer Connectivity Processor 1 Processor 2 Software Engineering
Software Engineering Logical vs Physical Connectivity and the relationship to Subsystem Layering Application Layer Application Layer Presentation Layer Session Layer Transport Layer Network Layer Data Link Layer Physical Layer Bidirectional associa- tions for each layer Presentation Layer Session Layer Transport Layer Network Layer Data Link Layer Physical Layer Processor 1 Processor 2 Logical Connectivity Layers Physical Connectivity
Subsystem 1 h 上海充通 Subsystem 2 SHANGHAI JIAO TONG Layer 2 Layer 1 Layer 3 Layer 2 Layer 4 Layer 3 Application Layer Application Layer Presentation Layer Presentation Layer Session Layer Session Layer Bidirectional associa-tions for each layer Transport Layer Transport Layer Network Layer Network Layer Data Link Layer Data Link Layer Hardware Hardware Processor 1 Processor 2 Software Engineering
Software Engineering Application Layer Presentation Layer Session Layer Transport Layer Network Layer Data Link Layer Hardware Bidirectional associa- tions for each layer Presentation Layer Session Layer Transport Layer Network Layer Data Link Layer Hardware Application Layer Layer 1 Layer 2 Layer 3 Layer 4 Subsystem 1 Processor 1 Processor 2 Layer 1 Layer 2 Layer 3 Subsystem 2